Cooling Module With Integrated Pump for Immersion Cooling in Electronics

Smart overview of the Invention

A cooling module designed for heat-generating electronic devices utilizes an integrated pump to enhance immersion cooling systems. This module draws immersion fluid from a dielectric bath and pressurizes it, directing the coolant through a nozzle plate with a microconvective nozzle array. The resulting microjets effectively cool the targeted electronic components by impinging on their surfaces, significantly improving heat dissipation compared to traditional methods.

Functionality and Design

The cooling module features a housing that contains the integrated pump, a nozzle plate, and various inlets and outlets to facilitate fluid movement. The pump can be either built into the module or affixed externally. Once installed on devices like CPUs or GPUs, the system immerses these components in a non-conductive fluid, which circulates to maintain optimal temperatures during operation.

Advantages Over Traditional Cooling Methods

Conventional cooling techniques, such as fan-cooled heat sinks, often fall short for modern compact electronic designs that generate significant heat. Immersion cooling systems with this new module address these challenges by enhancing fluid circulation and preventing stagnant areas that can lead to overheating. The integrated pump allows for higher flow rates and more effective thermal management.

Technical Specifications

• Includes a nozzle plate with multiple nozzles for creating microjets.
• The plenum within the housing allows for pressurization of the coolant.
• Compatible with various immersion cooling systems, including single-phase and two-phase setups.
• Designed for easy attachment to heat-generating devices mounted on printed circuit boards.

Potential Applications

This cooling module has wide-ranging applications in fields such as data centers, high-performance computing, cryptocurrency mining, and electric power inverters. By improving the efficiency of immersion cooling systems, it ensures that high-powered components operate within safe temperature limits, thereby enhancing performance and extending their operational lifespan.