US20250338703
2025-10-30
Electricity
H10H29/962
The patent describes a micro-light emitting diode (micro-LED) pixel arrangement that incorporates vertically stacked micro-LEDs. This structure includes a first micro-LED and a second micro-LED positioned above it, with differing levels in the vertical direction. A reflective layer is placed on the first micro-LED to redirect light emitted from either diode in the opposite direction. The sizes of the two micro-LEDs vary horizontally, and they are aligned vertically to optimize the main light emission direction.
The design includes a reflective layer on the first micro-LED, and attachment layers between the LEDs to facilitate stacking. These layers can be thicker than the LEDs themselves to ensure structural integrity. The pixel structure also incorporates transparent electrode layers for efficient electrical connectivity. The backplane supports transistors for each LED, with electrode pad layers connected through precise through holes in the attachment layers.
This configuration aims to improve light emission efficiency and simplify the manufacturing process. The vertical stacking of different colored LEDsβred, green, and blueβenhances color mixing and brightness. The reflective layers play a crucial role in boosting light output by reflecting emitted light back through the diodes, thus increasing overall efficiency.
The vertically stacked micro-LEDs can be integrated into various display devices and electronic apparatuses, enhancing display quality with higher brightness and color accuracy. This configuration supports mass production due to its simplified assembly process, potentially reducing costs and increasing accessibility for advanced display technologies.
The patent highlights innovations such as continuous transparent electrode films for seamless electrical connections and interconnection electrode layers that efficiently distribute power among the LEDs. These features contribute to a more robust and efficient LED display system, addressing previous challenges in bonding and efficiency found in traditional vertical stacking processes.