SEMICONDUCTOR DEVICE INCLUDING HYBRID DIAMOND THERMAL INTERPOSER

Smart overview of the Invention

The patent application describes a semiconductor device featuring a hybrid diamond thermal interposer designed to enhance thermal performance. This device includes a substrate and an interposer placed on its surface. Two semiconductor chips are positioned on the interposer's surface, with a hybrid diamond thermal interposer situated on one or both chips. The interposer comprises diamond particles embedded within a metal matrix, aimed at improving heat dissipation.

Background and Industry Needs

The semiconductor industry is experiencing a growing demand for devices with high input/output (I/O) capabilities, bandwidth, low latency, and power efficiency, all within a compact form factor. As logic dies and high bandwidth memory (HBM) packages require substantial power, there is a critical need for enhanced thermal management to maintain device performance and longevity. The hybrid diamond thermal interposer addresses these challenges by providing superior thermal conductivity without compromising mechanical integrity.

Technical Advantages

The integration of a hybrid diamond thermal interposer offers significant thermal performance improvements for semiconductor devices used in high-performance applications such as artificial intelligence, high-performance computing, and mobile devices. The thermal interface material (TIM) comprising diamond particles within a metal matrix ensures efficient heat dissipation, thereby supporting the device's mechanical stability during thermal cycles.

Design and Structure

The semiconductor device includes a substrate with an interposer and two semiconductor chips arranged on its surface. These chips are positioned in a manner that one chip is spaced apart from the other in a direction perpendicular to the substrate's primary orientation. The hybrid diamond thermal interposer is strategically placed on the surface of one or both chips, enhancing thermal management by leveraging the high thermal conductivity of diamond particles within a metal matrix.

Manufacturing Process

The method of manufacturing involves creating an intermediate device with a substrate, interposer, and the semiconductor chips. Subsequently, the hybrid diamond thermal interposer is applied to the chip surfaces, ensuring optimal thermal performance. This process is tailored to maintain the structural integrity of the device while achieving the desired thermal management benefits.