US20260095022
2026-04-02
Electricity
H01S5/026
Introduction: The invention focuses on enhancing hybrid silicon optical devices by incorporating a high refractive index spacer between a silicon waveguide and a III-V semiconductor material stack. This spacer, which can be doped or undoped, serves to improve the performance of optical devices such as lasers and semiconductor optical amplifiers (SOAs). By positioning the spacer between the waveguide and gain medium, the device benefits from reduced modal losses and increased mode area, which in turn enhances laser reliability and increases saturation power in SOAs.
Background: Photonic integrated circuits (PICs) are pivotal in modern computing applications, and integrating active optical devices like lasers on silicon substrates is crucial for advancement. Hybrid silicon devices that integrate III-V materials with silicon substrates are particularly promising for reducing manufacturing costs and coupling losses. However, challenges remain in achieving high optical power and narrow linewidths. The introduction of a high refractive index spacer aims to address these issues, offering a commercially advantageous solution for improving the performance of hybrid silicon optical devices.
Detailed Description: The invention describes various embodiments where a high refractive index spacer is utilized to achieve a larger, lower-loss optical mode. This spacer, which may be composed of doped or undoped III-V material or amorphous silicon, is strategically placed between the silicon waveguide and the active P-i-N structure. By doing so, the optical mode is shifted away from high-loss materials, reducing intrinsic laser loss and increasing mode size. This modification supports the creation of high-Q laser cavities with improved power and narrow linewidth light emission, as well as enhancing SOA performance by increasing saturation power.
Fabrication Methods: The patent outlines methods for fabricating hybrid silicon optical devices, such as quantum dot lasers and semiconductor optical amplifiers, using a high refractive index spacer. The process begins with receiving a donor substrate suitable for epitaxial growth, followed by the growth of a III-V P-i-N material stack. This stack, which includes gain materials like quantum wells or quantum dots, is then complemented by the epitaxial growth or deposition of the high index spacer. These methods can be applied to various hybrid silicon devices beyond lasers and SOAs, including photodetectors and modulators.
Conclusion: By introducing a high refractive index spacer in hybrid silicon III-V optical devices, the invention addresses critical challenges in optical device performance. This innovation not only reduces laser losses and increases mode area but also enhances the power and efficiency of SOAs. The described fabrication methods provide a pathway for integrating these improved devices into photonic integrated circuits, promising advancements in high-performance computing and communication applications.