US20260136963
2026-05-14
Electricity
H10W70/635
The semiconductor package integrates an optical device package to enhance data transmission capabilities, replacing traditional electrical backplane interfaces. The core structure includes an interposer with upper and lower interconnects linked via through vias. This configuration supports electronic and optical components, facilitating improved bandwidth density and energy efficiency, while minimizing optical coupling loss.
The package features a glass substrate on which a substrate optical waveguide is formed. A substrate redistribution structure connects the optical device to the interposer's upper interconnects. The optical device, mounted on the glass substrate, comprises a device optical waveguide that aligns with the substrate optical waveguide. An optical mold layer and an optical connector structure ensure seamless optical connectivity.
Various configurations are possible, including the integration of multiple electronic devices and bridge devices within the interposer body. These components are electrically interconnected, enhancing the package's versatility. The optical device package can also include cavities and protrusions on the glass substrate to accommodate different electronic and optical elements.
The production method involves patterning the glass substrate to form cavities and protrusions, creating substrate optical waveguides, and mounting optical devices. Protective layers and mold material layers are applied, followed by etching to form the optical mold layer. This process ensures precise alignment and connectivity of optical components.
The integration of optical devices in semiconductor packages addresses growing demands in bio health, AI, and robotics by enhancing data transmission efficiency. The design's flexibility allows for various implementations, supporting advancements in technology with improved energy efficiency and data handling capabilities.